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Méthodes numériques innovantes pour la simulation thermique de composants électroniques

Abstract : Electronic components have large geometric scale factors, and involve materials with very different thermal conductivities. Experience shows that in this context, the boundary element method is a good choice for thermal simulation in steady state. In transient regime, the temporal dimension adds a number of difficulties. Among these are typically higher computation time and stability criteria, or more generally the links between spatial and temporal discretizations. More specifically, a current issue in electronics is to measure the impact of highly localized phenomena, such as switching or short circuit on the overall thermal component. This is then coupled space-time scales, ensuring in particular the changes of scale without loss of information. In the first part of this work, we propose to use the transient boundary element method to address this problem. We combine first integral formulations and various optimization techniques to reduce the computational cost of the method. We then reuse this work to develop a multi-scale approach, and generalize the boundary element method for nonlinear materials. A second part is devoted to developing an alternative method, to reduce computation time more significantly while retaining a boundary element basis. This is a proper generalized decomposition method, which builds a separate representation of the solution within a non-incremental strategy. We study the convergence of the algorithm on different test cases, providing techniques for dealing with non-homogeneous boundary conditions and initial data, and nonlinear source terms.
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Contributor : Gaël Bonithon Connect in order to contact the contributor
Submitted on : Friday, December 17, 2010 - 4:04:24 PM
Last modification on : Wednesday, September 28, 2022 - 5:50:40 AM
Long-term archiving on: : Friday, March 18, 2011 - 3:34:42 AM


  • HAL Id : pastel-00547880, version 1


Gaël Bonithon. Méthodes numériques innovantes pour la simulation thermique de composants électroniques. Génie mécanique [physics.class-ph]. Arts et Métiers ParisTech, 2010. Français. ⟨NNT : 2010ENAM0047⟩. ⟨pastel-00547880⟩



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