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Étude de la fatigue des joints brasés de composants électroniques soumis à des sollicitations thermomécaniques, vibratoires et combinées

Abstract : The fatigue of electronic component solder joints under complex loadings in aeronautical, space and military applications is studied. The main goal of the thesis is to propose a generic fatigue model adapted to lead-free alloy under combined loads. The state of the art of solder alloy fatigue modelling is presented. Identification procedures for power law models are discussed. Continuum damage mechanics for solder alloy is also studied as this type of approach is more realistic for complex succession of loads as thermal cycling and random vibration. The second chapter presents an experimental and numerical study of the Sn- 3,0Ag-0,5Cu alloy low cycle shear fatigue. A viscoplastic with kinematic hardening behaviour law and a continuum damage model is established for isothermal low cycle fatigue. The impact of temperature is also underlined on experimental shear test results at 25 °C and 75 °C. Then an experimental study of electronic assemblies under random vibration is carried out. Fatigue trends for different types of components (BGA, PLCC...) are given for random vibration fatigue. Lead-free and leaded technologies underline the same failure modes in vibration. Finally a numérical methodology able to estimate a damage indicator for electronic assemblies under vibration is proposed. A concrete example is studied. The two approaches, low cycle and vibration fatigue, initiate the building of a generic model able to calculate the time to failure of assemblies under combined thermomechanical and vibration loads.
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Submitted on : Monday, June 6, 2011 - 10:58:16 AM
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  • HAL Id : pastel-00598315, version 1

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Marc Grieu. Étude de la fatigue des joints brasés de composants électroniques soumis à des sollicitations thermomécaniques, vibratoires et combinées. Matériaux. École Nationale Supérieure des Mines de Paris, 2010. Français. ⟨NNT : 2010ENMP0068⟩. ⟨pastel-00598315⟩

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