Simulation du procédé de nanoimpression thermiquesur silicium revêtu d’un film polymère ultramince

Abstract : Surface nanostructuring is an intriguing field of materials physics that has been largely ado-pted for both aesthetic and functional purposes. Nanostructures can be present in nature (water repellent effect of the lotus leaf) or produced for industrial applications, and they can be manufactured by lithography. Thermal nanoimprint is the process studied in this thesis, which is an inexpensive method to replicate the micro- and nanostructures of a mold into the surface of a substrate. This embossing method consists in printing the mold into a thin film of thermoplastic polymer (50 to 500 nm in thickness) previously deposited on the substrate. A further etching step may transfer the imprinted patterns into the latter. The aim of this work is to evaluate the imprint speeds of the structures in thin polystyrene films on a silicon substrate. A numerical simulation software has been developed, which uses the Constrained Natural Elements Method (C-NEM). Our main contribution was to integrate three essential phenomena at the nanoscale: surface tension, wetting, and slip at the fluid-solid interface. Combined with a non-linear viscous behavior, this is shown to describe partially but sufficiently the physical phenomena that occur during printing. Therefore, this work lies halfway between simple analytical models, with a very limited scope of use, and complex models too expensive for simulation, such as finite strain viscoelasticity. Finally, this thesis addresses the problem of the characterization of a polymer in thin films. One of the major challenges faced here was to apply the macroscopic mechanical behavior to thin films. The experimental validation of the theory developed in the first part has corroborated this approach and revealed its limitations. This set of theoretical and experimental developments is a first step towards the design of a numerical tool for optimizing the thermal nanoimprint process
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Hubert Teyssedre. Simulation du procédé de nanoimpression thermiquesur silicium revêtu d’un film polymère ultramince. Autre. Ecole nationale supérieure d'arts et métiers - ENSAM, 2013. Français. ⟨NNT : 2013ENAM0047⟩. ⟨pastel-00956591⟩

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