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Continuum vs. dislocation dynamics modelling of thin films

Abstract : The topic of the thesis is focused on the investigation of the mechanical properties of the copper thin films. These properties are investigated by the finite element method within the framework of classical crystal plasticity and discrete dislocation dynamics. The elasto-plastic simulations show that the presence of (001) and random oriented grains increases the level of stresses in adjacent (111) oriented grains. Comparison with experimental results shows that used model is not able to predict such high amount of hardening and level of stresses, which are measured during experiments. The evolution of hardening, plastic microstrain, and global and local surface roughness are investigated by the simulations of cyclic loading of copper polycrystalline aggregates. The hardening tends to saturate as well as the global roughness. The areas of the cumulated residual strain and areas with evolving local roughness are founded. These areas can be precursors of damage. The other approach in simulations of polycrystalline aggregates is represented by the discrete dislocation dynamics theory. The simulations show that the largest influence is given by the initial source length while the different film thickness does not change the results so much. The highest dislocation activity is observed in the (001) oriented grains and the lowest is in (111) oriented grains.
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Submitted on : Monday, January 14, 2008 - 2:30:36 PM
Last modification on : Wednesday, November 17, 2021 - 12:27:25 PM
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  • HAL Id : tel-00204422, version 1


Filip Siska. Continuum vs. dislocation dynamics modelling of thin films. Mechanics []. École Nationale Supérieure des Mines de Paris, 2007. English. ⟨NNT : 2007ENMP1481⟩. ⟨tel-00204422⟩



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