M. Abtew and G. Selvaduray, Lead-free Solders in Microelectronics, Materials Science and Engineering : R : Reports, vol.27, pp.95-141, 2000.

P. Armstrong and C. Frederick, A mathematical representation of the multiaxial Bauschinger effect, Materials at High Temperatures, vol.24, pp.1-26, 2007.

M. Ashby, A first report on deformation-mechanism maps, Acta Metallurgica, vol.20, pp.887-897, 1972.

J. Barralis and G. Maeder, Précis de métallurgie : élaboration, structures-propriétés et normalisation. Coll, vol.99, 1986.

C. Bathias and A. Pineau, Fatigue des matériaux et des structures : Tome 1, Introduction, endurance, amorçage et propagation des fissures, fatigue oligocyclique et gigacyclique, vol.151, p.148, 2008.

C. Bathias and A. Pineau, Fatique des matériaux et des structures : Tome 4 Fatigue multiaxiale, thermique, de contact, défauts, cumul et tolérance aux dommages, vol.149, p.121, 2009.

L. Bergers, J. Hoefnagels, N. Delhey, and M. Et-geers, Measuring timedependent deformations in metallic MEMS, Microelectronics Reliability, vol.51, p.140, 2011.

J. Besson, G. Cailletaud, J. Chaboche, and S. Forest, Mécanique non linéaire des matériaux, vol.142, 2001.

T. Bieler, H. Jiang, L. Lehman, and T. Kirkpatrick, « Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pbfree solder joints, IEEE Transactions on Components and Packaging Technologies, vol.31, p.98, 2008.

T. Bieler, B. Zhou, L. Blair, and A. Zamiri, « The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints, IEEE International Reliability Physics Symposium (IRPS), pp.573-581, 2011.

M. Bouarroudj-berkani and L. Dupont, Fatigue des composants Electroniques de puissance Physique de défaillance, vol.5, 2010.

S. Brown, K. Kim, and L. Et-anand, An internal variable constitutive model for hot working of metals, International Journal of Plasticity, vol.5, pp.95-130, 1989.

E. Busso, M. Kitano, and T. Kumazawa, Visco-plastic constitutive model for 60/40 tin-lead solder used in IC package joints, Journal of Engineering Materials and Technology, vol.114, p.144, 1992.

E. Busso, M. Kitano, and T. Kumazawa, A forward gradient time integration procedure for an internal variable constitutive model of Sn-Pb solder, International Journal for Numerical Methods in Engineering, vol.37, p.145, 1994.

S. K. Case and J. E. Et-gueths, Anisotropy of the temperature-dependent resistivity of tin between 8 and 300 degrees K ». Physical Review B-Solid State 2, vol.33, pp.3843-3848, 1970.

Y. Celnikier, L. Benabou, L. Dupont, and G. Coquery, « Investigation of the heel crack mechanism in Al connections for power electronics modules, Microelectronics Reliability, vol.51, pp.965-974, 2011.

E. Charkaluk, A. Bignonnet, A. Constantinescu, . Et-dang, and K. Van, Fatigue design of structures under thermomechanical loadings ». Fatigue & Fracture of Engineering Materials & Structures 25, vol.12, pp.1199-1206, 2002.
URL : https://hal.archives-ouvertes.fr/hal-00140317

R. Chaudhuri, M. Xie, and . Free, Composite Structures, vol.40, pp.129-136, 1997.

B. Chen and G. Li, « Influence of Sb on IMC growth in Sn-Ag-Cu-Sb Pb-free solder joints in reflow process, Thin Solid Films, vol.42, pp.395-401, 2004.

X. Chen, G. Chen, M. Et-sakane, and . Modified, Anand constitutive model for leadfree solder Sn-3.5Ag, Proceedings of the 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), p.144, 2004.

Z. Chen, M. He, and G. Qi, « Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization », Journal of Electronic Materials, vol.33, p.107, 2004.

S. Chen, C. Wang, S. Lin, and C. Chiu, « Phase diagrams of Pb-free solders and their related materials systems, Journal of Materials Science-Materials in Electronics, vol.18, pp.19-37, 2007.

S. Chen, C. Chen, W. Gierlotka, and A. Zi, « Phase Equilibria of the Sn-Sb Binary System, Journal of Electronic Materials, vol.37, pp.992-1002, 2008.

S. Chen, P. Chen, C. Chiu, Y. Huang, and C. Wang, Phase Equilibria of the Sn-Sb-Ag Ternary System (I) : Experimental ». Metallurgical and Materials Transactions A, vol.39, p.42, 2008.

M. Ciappa, Selected failure mechanisms of modern power modules, Microelectronics Reliability, vol.42, pp.653-667, 2002.

J. Clech, « Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag-Cu assemblies, SMTA International Conference. Chicago, vol.151, 2005.

L. F. Coffin, A study of the effects of cyclic thermal stresses on a ductile metal, Transasction of ASME, vol.76, p.149, 1954.

A. Constantinescu, E. Charkaluk, G. Lederer, and L. Verger, International Journal of Fatigue, vol.26, pp.805-818, 2004.

C. Coston and N. Nachtrieb, Self-Diffusion in Tin at High Pressure, Journal of Physical Chemistry, vol.68, pp.2219-2229, 1964.

J. Cugnoni, J. Botsis, V. Sivasubramaniam, and J. Janczak-rusch, Experimental and numerical studies on size and constraining effects in lead-free solder joints ». Fatigue and Fracture of Engineering Materials and Structures, vol.30, pp.387-399, 2007.

R. Darveaux, Effect of simulation methodology on solder joint crack growth correlation, Proceedings of the 50th Electronic Components & Technology Conference (ECTC), pp.1048-1058, 2000.

X. Deng, N. Chawla, K. Chawla, and M. Et-koopman, Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation, Acta Materialia, vol.52, pp.4291-4303, 2004.

X. Deng, M. Koopman, N. Chawla, K. Chawla, and . Young, s modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation, Materials Science and Engineering : A, vol.364, pp.240-243, 2004.

V. Deshpande and D. Sirdeshmukh, Thermal Expansion of Tin in Beta-Gamma Transition Region, Acta Crystallographica, vol.15, p.33, 1962.

G. Dieter, D. Bacon, and . Metallurgy, , vol.143, 1988.

R. Doherty, D. Hughes, F. Humphreys, and J. Jonas, Current issues in recrystallization : a review ». Materials Science and Engineering : A, vol.238, issue.2, pp.219-274, 1997.

B. Dompierre, « Fiabilité mécanique des assemblages électroniques utilisant des alliages du type SnAgCu, vol.153, p.134, 2011.

J. Dorkel, Semi-conducteurs de puissance Problèmes thermiques (partie 1) ». Techniques de l'ingénieur d3112, vol.10, 2003.

A. Drevin-bazin, Module de puissance à base SiC fonctionnant à haute température, vol.137, 2013.

A. Drevin-bazin, F. Lacroix, and J. Barbot, SiC Die Attach for HighTemperature Applications », Journal of Electronic Materials, vol.43, pp.695-701, 2014.

P. Dubus, R. Leon, D. Le-guyader, and L. Caves, Thermal pre-dimensioning methodology based on thermal impedance, Proceedings of the 6th International Conference on Integrated Power Electronics Systems (CIPS), vol.11, 2010.

R. Dudek, W. Faust, A. Gollhard, and B. Michel, A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy, Proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), vol.172, p.168, 2006.

B. Dyson, « Diffusion of Gold and Silver In Tin Single Crystals », Journal of Applied Physics, vol.37, pp.2375-2377, 1966.

B. Dyson, T. Anthony, and D. Turnbull, Interstitial Diffusion of Copper in Tin, Journal of Applied Physics, vol.38, issue.cf, p.32, 1967.

W. Engelmaier, The use environments of electronic assemblies and their impact on surface mount solder attachment reliability, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol.13, pp.903-908, 1990.

H. Frost and F. Ashby, Deformation-mechanism maps : the plasticity and creep of metals and ceramics, vol.134, 1982.

A. Geranmayeh, G. Nayyeri, and R. Mahmudi, Microstructure and impression creep behavior of lead-free Sn-5Sb solder alloy containing Bi and Ag, Materials Science and Engineering : A, vol.547, p.146, 2012.

M. Geuffrard, Amorçage et micro-propagation de fissure en fatigue à haute température à partir de défauts dans un superalliage monocristallin, vol.151, 2010.

G. Ghosh, « Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints, Acta Materialia, vol.49, pp.2609-2624, 2001.

W. Gierlotka, Y. Huang, and S. Et-chen, Phase Equilibria of Sn-Sb-Ag Ternary System (II) : Calculation ». Metallurgical and Materials Transactions A, vol.39, pp.3199-3209, 2008.

M. Grieu, G. Massiot, O. Maire, and C. Munier, « Modelling of Sn3.0AgO.5Cu thermo-mechanical behaviour by a continuum damage approach, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), vol.137, 2009.

M. Grieu, Etude de la fatigue des joints brasés de composants électroniques soumis a des sollicitations vibratoires et combinées, 2010.

L. Grodzins, Optimum energies for X-Ray transmission tomography of small samples-Applications of synchrotron radiation to computerized-tomography .1. » Nuclear Instruments & Methods in, Physics Research, vol.206, issue.3, pp.541-545, 1983.

L. Helfen, T. Baumbach, P. Mikulik, and D. Kiel, High-resolution threedimensional imaging of flat objects by synchrotron-radiation computed laminography, Applied Physics Letters, vol.86, p.50, 2005.

L. Helfen, T. Baumbach, P. Pernot, and P. Mikulik, High-resolution three-dimensional imaging by synchrotron-radiation computed laminography-art. no. 63180N ». Developments in X-Ray Tomography V, Proc SPIE, vol.6318, p.50, 2006.

L. Helfen, F. Xu, H. Suhonen, P. Cloetens, and T. Baumbach, Laminographic imaging using synchrotron radiation-challenges and opportunities, Proceedings of the 11th International Conference on Synchrotron Radiation Instrumentation (SRI). T. 425, vol.51, p.50, 2013.
URL : https://hal.archives-ouvertes.fr/hal-01572991

D. W. Henderson, J. Woods, T. Gosselin, and J. Bartelo, « The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue, Journal of Materials Research, vol.19, pp.1608-1612, 2004.

C. E. Ho, Y. L. Lin, C. R. Kao, and . Strong, Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni, Chemistry of Materials, vol.14, pp.949-951, 2002.

E. Hodulova, M. Palcut, E. Lechovic, B. Simeková, and K. Ulrich, Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate, Journal of Alloys and Compounds, vol.509, pp.7052-7059, 2011.

D. House and E. Vernon, « Determination of The Elastic Moduli of Tin Single Crystals, and their Variation with Temperature, British Journal of Applied Physics, vol.11, issue.6, pp.254-259, 1960.

T. Hung, C. Huang, C. Lee, and C. Wang, « Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period, Microelectronic Engineering, vol.107, pp.125-129, 2013.

L. Jiang and N. Chawla, Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing, Scripta Materialia, vol.63, pp.480-483, 2010.

W. Jones, E. Bowen, . The, and . Snsb, Nature, vol.126, pp.846-847, 1930.

A. Kaabi, Substrat architecturé et brasure composite sans plomb pour l'électronique de puissance de véhicules électriques ou hybrides : Conception & Procédés, vol.163, p.11, 2011.

A. Kaabi, Y. Bienvenu, D. Ryckelynck, and B. Pierre, Architectured Materials to Improve the Reliability of Power Electronics Modules : Substrate and LeadFree Solder, Journal of Electronic Materials, vol.43, pp.648-657, 2014.
URL : https://hal.archives-ouvertes.fr/hal-00955777

S. Kang, W. Choi, D. Shih, and N. Donald, « Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu », JOM, vol.55, pp.61-65, 2003.

Y. Kariya, N. Williams, C. Gagg, and W. Et-plumbridge, Tin pest in Sn-0.5 wt.% Cu lead-free solder, JOM-The Journal of The Minerals, vol.53, pp.39-41, 2001.

K. Kim, S. Huh, and K. Suganuma, Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys, Materials Science & Engineering, A, vol.333, issue.1-2, pp.106-114, 2002.

D. Kwon, Intermetallic Formation and Growth ». A Guide to Lead-free Solders, vol.36, pp.97-126, 2007.

S. L. Lai, J. Y. Guo, V. Petrova, G. Ramanath, and L. H. Et-allen, SizeDependent Melting Properties of Small Tin Particles : Nanocalorimetric Measurements, Physical Review Letters, vol.77, pp.99-102, 1996.

J. Lee and Y. Kim, Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering, Journal of Electronic Materials, vol.31, p.43, 2002.

H. Lee, H. Lin, C. Lee, and P. Et-chen, « Reliability of Sn-Ag-Sb leadfree solder joints, Materials Science and Engineering : A, vol.407, issue.1-2, p.43, 2005.

C. C. Lee, P. J. Wang, and J. S. Kim, Are intermetallics in solder joints really brittle ?, Proceedings of the 57th Electronic Components and Technology Conference (ECTC), vol.45, pp.648-652, 2007.

T. Lee, K. Liu, and . Bieler, Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints, Journal of Electronic Materials, vol.38, p.93, 2009.

T. Lee, H. Ma, K. Liu, and J. Et-xue, Impact of Isothermal Aging on LongTerm Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects : Surface Finish Effects », Journal of Electronic Materials, vol.39, p.92, 2010.

T. Lee, B. Zhou, L. Blair, K. Liu, and T. Bieler, Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy », Journal of Electronic Materials, vol.39, issue.cf, p.32, 2010.

L. Lehman, S. Athavale, T. Fullem, and A. Giamis, Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder, vol.33, pp.35-38, 2004.

J. Lemaitre, J. Chaboche, A. Benallal, and R. Desmorat, Mécanique des matériaux solides-3ème édition, Dunod, vol.191, 2009.

J. Liang, N. Dariavach, and D. Et-shangguan, Solidification condition effects on microstructures and creep resistance of Sn-3.8Ag-0.7Cu lead-free solder, Metallurgical and Materials Transactions A, vol.38, p.49, 2007.

G. Lovato, F. Moret, L. Gallo, P. Cailletaud, G. Et-pilvin et al., Determination of brazed joint constitutive law by inverse method, vol.136, p.135, 1993.
URL : https://hal.archives-ouvertes.fr/jpa-00251807

M. Lu, D. Shih, P. Lauro, C. Goldsmith, and D. W. Henderson, Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders, Applied Physics Letters, vol.92, p.97, 2008.

J. L. Lumley, The structure of inhomogeneous turbulence ». Atmospheric Turbulence and Wave Propagation, pp.166-178, 1967.

H. Ma, J. Suhling, P. Lall, and M. Bozack, « Effects of aging on the stressstrain and creep behaviors of lead free solders, Proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM), pp.961-976, 2006.

H. Ma, J. Suhling, Y. Zhang, P. Lall, and M. Bozack, The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints, Proceedings of the 57th Electronic Components and Technology Conference (ECTC), pp.653-668, 2007.

H. Ma, Constitutive models of creep for lead-free solders, Journal of Materials Science, vol.44, pp.3841-3851, 2009.

H. Ma and J. C. Suhling, « A review of mechanical properties of lead-free solders for electronic packaging, Journal of Materials Science, vol.44, pp.1141-1158, 2009.

O. Maceijak and P. Aubert, Mesure de dureté par nano-indentation, Techniques de l'ingénieur nm7200, vol.75, 2007.

M. Maleki, J. Cugnoni, and J. Botsis, Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder, Acta Materialia, vol.61, pp.103-114, 2013.

M. Maleki, J. Cugnoni, and J. Botsis, Isothermal Ageing of SnAgCu Solder Alloys : Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response, Journal of Electronic Materials, vol.43, pp.92-95, 2014.

S. S. Manson, Behavior of materials under conditions of thermal stress, NACA TN, vol.2933, p.149, 1953.

D. Marquardt and . An, Algorithm for Least-Squares Estimation of Nonlinear Parameters », Journal of the Society for Industrial and Applied Mathematics, vol.11, issue.2, pp.431-441, 1963.

D. Masson and B. Kirkpatrick, Equilibrium Solidification of Sn-Ag-Sb Thermal Fatigue-Resistant Solder Alloys, Journal of Electronic Materials, vol.15, pp.349-353, 1986.

M. Mathew, H. Yang, S. Movva, and K. Murty, Creep deformation characteristics of tin and tin-based electronic solder alloys, Metallurgical and Materials Transactions, vol.36, p.147, 2005.

M. Matin, W. Vellinga, and M. Et-geers, Microstructure evolution in a Pb-free solder alloy during mechanical fatigue, Materials Science and Engineering : A, vol.431, issue.2, pp.166-174, 2006.

S. Michaelides and S. Et-sitaraman, Die cracking and reliable die design for flipchip assemblies, IEEE Transactions on Advanced Packaging, vol.22, pp.602-613, 1999.

K. Moon, W. Boettinger, U. Kattner, F. Biancaniello, and C. Handwerker, Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys, Journal of Electronic Materials, vol.29, pp.33-35, 2000.

J. Morelle, K. Tan, L. Vivet, R. Leon, and S. Lavrentieff, Alternative lead free die attach for power module packaging, 7th International Conference on Integrated Power Electronics Systems (CIPS), vol.163, 2012.

D. Napp, Manufacturing Technologies-Present and Future', Seventeenth IEEE/CPMT International, tronics Manufacturing Technology Symposium, vol.8, pp.238-244, 1995.

K. Nogita and T. Nishimura, Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn-CuNi lead-free solder alloys, Scripta Materialia, vol.59, pp.191-194, 2008.

L. Noren, R. Withers, S. Schmid, F. Brink, V. Ting et al., SnSb" revisited ». Journal of Solid State Chemistry, vol.179, issue.2, pp.404-412, 2006.

C. Oh, J. Shim, B. Lee, and D. N. Et-lee, A thermodynamic study on the Ag-Sb-Sn system, Journal of Alloys and Compounds, vol.238, issue.2, p.41, 1996.

I. Ohnuma, M. Miyashita, K. Anzai, and X. Liu, « Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys, Journal of Electronic Materials, vol.29, pp.1137-1144, 2000.

H. Ohtani, K. Okuda, and K. Ishida, Thermodynamic study of phase equilibria in the Pb-Sn-Sb system, Journal of Phase Equilibria, vol.16, pp.416-429, 1995.

H. Okamoto and . Ni-sn, Journal of Phase Equilibria and Diffusion, vol.29, pp.297-298, 2008.

H. Okamoto and . Sb-sn, Antimony-Tin) ». Journal of Phase Equilibria and Diffusion, vol.33, p.347, 2012.

W. Oliver and G. Pharr, « An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Journal of Materials Research, vol.7, issue.6, pp.1564-1583, 1992.

A. Osawa, An intermetallic compound having a simple cubic lattice, Nature, vol.124, p.14, 1929.

K. C. Otiaba, M. Okereke, and R. Bhatti, Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material, Applied Thermal Engineering, vol.64, pp.51-63, 2014.

J. H. Pang, B. Xiong, and T. Low, « Low cycle fatigue models for lead-free solders, Thin Solid Films, pp.149-151, 2004.

P. Pavone, S. Baroni, S. Gironcoli, and . De, « alpha <-> beta phase transition in tin : A theoretical study based on density-functional perturbation theory, Physical Review B, vol.57, pp.10421-10423, 1998.

G. Petzow and G. Effenberg, Ternary alloys : a comprehensive compendium of evaluated constitutional data and phase diagrams. T. 2. VCH, 1988 (cf, vol.42, p.36

G. Pottier, M. Viau, M. Ricoul, and G. Shim, Lead Exposure Induces Telomere Instability in Human Cells, vol.8, 2013.

L. Priester, Les joints de grains : de la théorie à l'ingénierie, EDP Sciences, vol.101, 2006.

K. Puttlitz and G. Et-galyon, « Impact of the ROHS directive on high-performance electronic systems, Journal of Materials Science : Materials in Electronics, vol.18, issue.1-3, pp.331-346, 2007.

A. Raciti and D. Cristaldi, Thermal modeling of integrated power electronic modules by a lumped-parameter circuit approach, AEIT Annual Conference, vol.11, 2013.

J. Radon, On the determination of functions from their integral values along certain manifolds, IEEE Transactions on Medical Imaging, vol.5, pp.170-176, 1986.

W. Ramberg and W. R. Osgood, Description of stress-strain curves by three parameters, NACA TN, vol.902, 1943.

S. Ramminger, P. Turkes, and G. Wachutka, Crack mechanism in wire bonding joints ». Microelectronics Reliability, vol.38, pp.1301-1305, 1998.

J. Rayne and B. Et-chandrasekhar, Elastic Constants of Beta-Tin from 4.2Degrees-K To 300-Degrees-K, Physical Review, vol.120, pp.1658-1663, 1960.

D. T. Read, Young's modulus of thin films by speckle interferometry, Science and Technology, vol.9, p.676, 1998.

M. Rizzi, « Contribution à l'étude de la fiabilité des modules de puissance pour application automobile, 2008.

M. Roellig, R. Dudek, S. Wiese, and B. Boehme, « Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept, Microelectronics Reliability, vol.47, pp.187-195, 2007.

A. Rosenberg and W. Winegard, The rate of growth of dendrites in supercooled tin, Acta Metallurgica, vol.2, issue.2, pp.342-343, 1954.

D. Ryckelynck, A priori hyperreduction method : an adaptive approach, Computational Physics, vol.202, pp.346-366, 2005.

D. Ryckelynck, F. Chinesta, E. Cueto, and A. Et-ammar, On the a priori model reduction : Overview and recent developments, Archives of Computational Methods in Engineering, vol.13, issue.1, pp.91-128, 2006.
URL : https://hal.archives-ouvertes.fr/hal-01633395

D. Ryckelynck, Hyper-reduction of mechanical models involving internal variables », International Journal for Numerical Methods in Engineering, vol.77, pp.75-89, 2009.
URL : https://hal.archives-ouvertes.fr/hal-00359157

D. Ryckelynck, F. Vincent, and S. Cantournet, Multidimensional a priori hyper-reduction of mechanical models involving internal variables, Computer Methods in Applied Mechanics and Engineering, vol.225, pp.28-43, 2012.
URL : https://hal.archives-ouvertes.fr/hal-00705783

C. Schmetterer, H. Flandorfer, K. W. Richter, and U. Saeed, A new investigation of the system Ni-Sn, vol.15, pp.869-884, 2007.

H. Schoeller, S. Bansal, A. Knobloch, D. Shaddock, and J. Cho, Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn5Sb, ASME Conference Proceedings, vol.48678, pp.25-32, 2008.

H. Schoeller, S. Bansal, A. Knobloch, D. Shaddock, and J. Cho, Microstructure evolution and the constitutive relations of high-temperature solders, Journal of Electronic Materials, vol.38, pp.802-809, 2009.

D. Schweitzer and . Fast, Algorithm for Thermal Transient Multisource Simulation Using Interpolated Zth Functions, IEEE Transactions on Components and Packaging Technologies, vol.32, pp.478-483, 2009.

A. Schmidt, A. Potschka, S. Körkel, H. Bock, and . Derivative, Extended POD Reduced-Order Modeling for Parameter Estimation, SIAM Journal on Scientific Computing, vol.35, pp.2696-2717, 2013.

D. Schiferl and C. S. Barrett, The crystal structure of arsenic at 4.2, 78 and 299°K », Journal of Applied Crystallography, vol.2, issue.1, pp.30-36, 1969.

J. Secondé, Microstructure et Rhéologie des alliages Sn-Pb semi solides, INP Grenoble, vol.60, p.49, 1984.

C. Sellars and W. Tegart, « La relation entre la résistance et la structure dans la déformation à chaud, Mémoires Scientifiques de la Revue de Metallurgie, vol.63, p.143, 1966.

S. Seo, S. Kang, M. Cho, D. Shih, and H. Et-lee, The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy », Journal of Electronic Materials, vol.38, pp.2461-2469, 2009.

Y. Shen, N. Chawla, E. Ege, and X. Deng, Deformation analysis of lap-shear testing of solder joints, Acta Materialia, vol.53, p.136, 2005.

J. Shen, Y. C. Chan, and S. Y. Liu, Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction, Acta Materiala, vol.57, pp.5196-5206, 2009.

X. Shi, W. Zhou, H. Pang, and . Wang, Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy, Journal of Electronic Packaging, vol.121, p.142, 1999.

J. W. Sofia, Fundamentals of Thermal Resistance Measurement, Analysis Tech, vol.12, 1995.

D. Swenson, The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints, Journal of Materials Science : Materials in Electronics, vol.18, issue.1-3, pp.36-38, 2007.

A. Tasooji, L. Lara, and K. Lee, Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints, Journal of Electronic Materials, vol.43, p.97, 2014.

A. Telang and T. Bieler, « Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens, Scripta Materialia, vol.52, p.37, 2005.

A. Telang, T. Bieler, A. Zamiri, and F. Pourboghrat, Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint, Acta Materialia, vol.55, pp.2265-2277, 2007.

J. R. Teo and Y. Sun, Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading, Acta Materialia, vol.56, p.67, 2008.

S. Terashima, K. Takahama, M. Nozaki, and M. Tanaka, Recrystallization of sn grains due to thermal strain in Sn-1, Materials Transactions, vol.45, pp.1383-1390, 2004.

S. Terashima, T. Kobayashi, and M. Tanaka, Effect of crystallographic anisotropy of beta-tin grains on thermal fatigue properties of Sn-1Ag-0.5Cu and Sn3Ag-0.5Cu lead free solder interconnects, Science and Technology of Welding and Joining, vol.13, pp.732-738, 2008.

S. Terashima, T. Kohno, A. Mizusawa, and K. Arai, « Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio's Wafer-Level Packages Based on Morphology and Grain Boundary Character », Journal of Electronic Materials, vol.38, p.100, 2009.

J. Thomas, L. Verger, A. Bignonnet, and E. Charkaluk, Thermomechanical design in the automotive industry, Fatigue & Fracture of Engineering Materials & Structures, vol.27, pp.887-895, 2004.
URL : https://hal.archives-ouvertes.fr/hal-00104247

N. Torazawa, S. Arai, Y. Takase, K. Sasaki, and H. Et-sakane, Transmission electron microscopy of interfaces in joints between Pb-free solders and electroless Ni-P », Materials transactions-JIM, vol.44, pp.1438-1447, 2003.

V. Vassiliev, M. Lelaurain, and J. Hertz, A new proposal for the binary (Sn,Sb) phase diagram and its thermodynamic properties based on a new emf study, Journal of Alloys and Compounds, vol.247, pp.223-233, 1997.

L. Vivet, A. Joudrier, K. Tan, and J. Morelle, « Influence of nickel-phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications, Applied Surface Science, vol.287, pp.13-21, 2013.

G. Wang, Z. Cheng, K. Becker, and J. Wilde, Applying Anand model to represent the viscoplastic deformation behavior of solder alloys, Journal of Electronic Packaging, vol.123, pp.247-253, 2001.

Q. Wang, L. Liang, X. Chen, and X. Weng, « Experimental determination and modification of anand model constants for Pb-free material 95-5Sn4.0Ag0.5Cu, Proceedings of the 8th International Conference on Thermal, Mechanical and MultiPhysics Simulation Experiments in Microelectronics and Micro-Systems (EuroSimE), 2007.

S. Wiese and S. Et-rzepka, Time-independent elastic-plastic behaviour of solder materials, Microelectronics Reliability, vol.44, pp.1893-1900, 2004.

E. Wood and K. Nimmo, In search of a new lead-free electronic solders, Journal of Electronic Materials, vol.23, pp.709-713, 1994.

P. Yang, Y. Lai, S. Jian, J. Chen, and R. Chen, « Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples, Materials Science and Engineering A, vol.485, pp.305-310, 2008.

K. Yazzie, J. Williams, N. Phillips, F. D. Carlo, and N. Chawla, Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography », Materials Characterization, vol.70, pp.33-41, 2012.

D. Yeh and H. Huntington, Extreme Fast-Diffusion System-Nickel in SingleCrystal Tin, Physical Review Letters, vol.53, pp.1469-1472, 1984.

L. Yin, L. Wentlent, L. Yang, and B. Arfaei, « Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue », Journal of Electronic Materials, vol.41, issue.2, pp.98-100, 2012.

J. Yoon, S. Kim, and S. Jung, « Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging, Journal of Alloys and Compounds, vol.391, pp.95-97, 2005.

M. Yunus, K. Srihari, J. Pitarresi, and A. Primavera, Effect of voids on the reliability of BGA/CSP solder joints, Microelectronics Reliability, vol.43, pp.2077-2086, 2003.

L. Zhang, J. Han, C. He, and Y. Et-guo, « Reliability behavior of lead-free solder joints in electronic components, Journal of Materials Science-Materials in Electronics, vol.24, pp.172-190, 2013.

B. Zhou, T. Bieler, T. Lee, and K. Liu, Crack Development in a LowStress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface », Journal of Electronic Materials, vol.39, pp.2669-2679, 2010.

B. Zhou, T. Bieler, T. Lee, and W. Liu, Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD », Journal of Electronic Materials, vol.42, pp.319-331, 2013.

B. Zhou, G. Muralidharan, K. Kurumadalli, and C. Parish, « Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications, Journal of Electronic Materials, vol.43, p.129, 2014.

, Energy Information Administration, the. International Energy Outlook, issue.2, 2013.

, European Parliament, the et Council of the European Union, the. Directive of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment

, The 2013 EU Industrial R&D Investment Scoreboard, vol.3

M. Faessel, Simple Morphological Image Library, vol.231, p.55
URL : https://hal.archives-ouvertes.fr/hal-00836117

, bandes de glissement persistantes (BGP), 121 barrière de diffusion, vol.45, p.103

, BGA, vol.20, p.153

, chargements complexes, vol.10, p.136

. Coffin-manson, , vol.149, p.166

. , Die Laser Soldering, vol.186, p.12, 0194.

, 171 fatigue polycyclique, 148 fatigue thermique, vol.15, p.169

. , orientation des grains, vol.69, p.129

, SAC, vol.8, issue.9, p.149

, vieillissement isotherme, vol.45, p.237