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Matériau architecturé à base de cuivre pour l’électronique de puissance : Substrats pour modules de puissance

Abstract : This work is part of ‘MeGaN” project which focuses on the development of new power module technologies based on "GaN" wide gap components, compatible with high temperature and high voltages applications. In This study, a new substrate an innovative thermal bridge composite (i-TBC) has been developed, obtained by roll bonding of two copper sheets separated by perforated invar. The i-TBC is an “architectured” composite material that combines good thermal conductivity associated to copper and limited CTE due to the presence of invar. A particularity of the i-TBC consists of the formation of copper bonding area through the invar perforations during the cold rolling called thermal bridges. These thermal bridges, ensure good thermal conductivity of the i-TBC. Thus, a first part of this work focuses on the microstructural characterization of the i-TBC substrate during the stages of its elaboration, the objective is to understand the impact of the elaboration steps on the adhesion formationof the copper interfaces. in thermal bridges. It was thus demonstrated that the cold welding obtained along the interface Cu-Cu was a guarantee of good adhesion. In the second part, we focused on the characterization of the mechanical strength of the i-TBC substrate under passive thermal cycling conditions. To do this, tests of thermal fatigue and thermal shock allow us todetermine the sensitivity of the mechanical resistance of the interfaces to both the amplitude and the speed of temperature variation. The conclusion of this study is that the parameters of cold rolling must allow a compromise between adhesion of the Cu-Cu bridge and Cu-Invar interfaces to significantly increase the lifetime of the substrate. Finally, a finite element analysis (FEA) wasperformed. firstly, the thermal modeling validated the thermal performance of the i-TBC substrate in an electronic assembly.Then, the intrinsic properties were established in terms of mechanical behavior of the Cu-Invar composite and deterioration of the interfaces in the form of propagation ofa crack at the Cu-Cu interface.
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Submitted on : Thursday, January 16, 2020 - 8:30:15 AM
Last modification on : Wednesday, November 17, 2021 - 12:28:38 PM
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  • HAL Id : tel-02439120, version 2


Hiba Fekiri. Matériau architecturé à base de cuivre pour l’électronique de puissance : Substrats pour modules de puissance. Mécanique des matériaux [physics.class-ph]. Université Paris sciences et lettres, 2018. Français. ⟨NNT : 2018PSLEM085⟩. ⟨tel-02439120v2⟩



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